CSP
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Introduction
| CSP封裝肖特基勢壘整流二極管目錄 CSP Schottky Barrier Diode Catalog | ||||||||
| 0.5-1.5A Schottky | ||||||||
| NO。 | 產品類型 | 封裝類型 | IF(A) | VRRM(V) | IFSM(A) | VFM@ IF(V) | IRM@ VRRM(µA) | Tj（℃） |
| Wafer Type | Package Type | |||||||
| 1 | TW0530CSP | 3bump凸點 | 0.5 | 30 | 10 | 0.40@0.5A 0.44@1A | 10@30V | 125 |
| 2 | TW05H40CSP | 3bump凸點 | 0.5 | 40 | 10 | 0.45@0.5A 0.52@1A | 1@40V | 125 |
| 3 | TW0730CSP | 3bump凸點 | 0.75 | 30 | 10 | 0.45@0.75A 0.50@1.5A | 10@30V | 125 |
| 4 | TW07H40CSP | 3bump凸點 | 0.75 | 40 | 10 | 0.50@0.75A 0.58@1.5A | 1@40V | 125 |
| 5 | TW130CSP | 4ball焊球 | 1 | 30 | 21 | 0.37@1A 0.42@2A | 30@30V | 125 |
| 6 | TW140CSP | 4ball焊球 | 1 | 40 | 21 | 0.40@1A 0.46@2A | 10@40V | 125 |
| 7 | TW1H40CSP | 4ball焊球 | 1 | 40 | 21 | 0.43@1A 0.49@2A | 3@40V | 125 |
| 8 | TW230CSP | 4ball焊球 | 1.5 | 30 | 21 | 0.42@1.5A 0.48@3A | 30@30V | 125 |
| 9 | TW240CSP | 4ball焊球 | 1.5 | 40 | 21 | 0.45@1.5A 0.50@3A | 15@40V | 125 |
| 10 | TW2H40CSP | 4ball焊球 | 1.5 | 40 | 21 | 0.48@1.5A 0.54@3A | 3@40V | 125 |
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